الفهرس 
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Abstract
It has been established that Rapid Solidification Processing can produce high strength materials with a considerable ductility and high corrosion resistance by refining the grain structure of the processed metallic alloys. Two types of alloys are important for most industrial applications; the bearing and solder alloys. Bearing alloys are used in all types of machinery , engines and mechanisms for supporting and controlling the motion of rotating sliding or reciprocating parts . Bearing alloys must satisfy hard conditions of operation, i.e.; high strength and ductility . To satisfy this condition the alloy must have soft matrix in which hard particles of some intermetallic compounds are embedded. Solder alloys are non-ferrous alloys that have melting point below 450 °C . In electronics the solder alloys must have low melting temperature, low resistivity and high strength . In this work, various amounts of antimony element have been added to the Pb40Sn60 to form solder alloys. The Pb40Sn60 near eutectic has been produced by rapid solidification using melt spinning technique with various amounts of antimony have been added to it, in the ratio 3, 5 , 7, 10, 12 and 15 wt.% . X-ray diffraction (XRD) analysis and differential thermal analysis (DTA) have been carried out. Then the alloys were examined by electron scanning microscopy. Microhardness measurements were also carried out. The results showed that, the ternary alloys up to 7 wt.% Sb has properties superior to binary alloy. Antimony up to 7wt. % increases the Young’s modulus and decrease the internal friction. The binary and ternary alloys have a lower melting point about 184 °C and 187 °C, respectively which is comparable with eutectic Sn-37wt.% Pb solder alloy. The liquid temperature and narrow “pasty range” make it easy to form and maintain consistent high, rounded, beaded seams. Because of its relatively low melting point, solder is easy to rework to maintain a smooth finish solder bead. Also, the results show that the formation of SnSb intermetallic compound and development in Vicker hardness are due to the addition of Sb element. Addition of Sb refines the crystal size of Sn, Sb and SbSn in case of melt spun alloys as seen in scanning electron micrographs and X-ray diffraction. Also, electrical resistivity and resistance temperature coefficient are measured and plotted against the Sb wt.% .