الفهرس 
Cooling fluidsOnly 14 pages are availabe for public view
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Abstract
In this study, a numerical simulation of fluid flow and heat transfer in a computer system enclosure has been carried out. The cooling solution provided for an 80 W heat dissipating processor is found insufficient to cool down a higher heat dissipating processor. Hence, a different group of heat sinks and different group of thermo electrics are used. A detailed parametric study carried out and the effect of various parameters on the maximum CPU case temperature and the maximum temperature of the other components was examined. The acoustic emission of the system is also considered in the present study. 1. TEC has an effect on CPU temperature decreasing by about 16°C comparing with heat sink. 2. The heat flux can be increased from 5 W/cm² to 8.4 W/cm² by using the thermoelectric cooling system, and so the manufacturers can increase the processors speed. 3. CEF for thermoelectric reaches to 1.8, But the best heat sink has a CEF of .79. 4. In experimental work, TEC temperature reaches 4°C. Chapter (6) Conclusion and Recommendations 165 6.2 RECOMMENDATIONS AND FUTURE WORK In view of the importance of equipment’s cooling, it’s recommended to conduct further investigations aided by full scale measurements. These measurements must focus on the applicability of the TEC cooling systems in the different applications in Egypt, taking advantage of the energy consumption reduced by this system. Advanced studies are still needed to investigate the cooling effectiveness Also, further studies for the following future works are suggested these suggestions may include: 1- Cooperation with computer and automatic control engineering department for modeling the case completely and found if there any problem during cooling with TEC.