الفهرس 
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Abstract
SnSbBi alloy is important for industrial applications such as electronic applications. The aim of this research was to improve the physical properties of SnSbBi alloy by adding aluminium content. To verify this aim:- A series of tin-antimony-bismuth-aluminium alloys containing up to 20 wt% aluminium were prepared and quenched from the melt to room temperature by Chill methods (Spinning technique). Also different experimental techniques such as (X-ray diffraction analysis, scanning electron microscope SEM, double-bridge method, differential thermal analysis DTA, dynamic resonance method and Vickers hardness Test) were used to study structure, electrical, thermal and mechanical properties of prepared alloys. The electrical resistivities are reported for temperatures between 280 and 400K for all the melt-quenched ribbons of (Sn80-x-Sb10-Bi10-Alx) (where x= 0 , 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10, 15 and 20 in wt%) . The microhardness, elastic moduli, internal friction and thermal diffusivity were also measured from melt-quenched ribbons. from this studying: Electrical resistivity and internal friction of SnSbBi alloy decrease but elastic modulus and hardness increased after adding aluminium content. It is found that entropy change, enthalpy, TCR and specific heat decreases with increasing aluminium content. The Sn60Sb10Bi10Al20 has the best properties for electronic applications. Finally it is confirmed from our data that low melting alloy are functional components of low voltage high capacity blade-contact fuses.