الفهرس 
IntroductionOnly 14 pages are availabe for public view
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Abstract
Thermal analysis and microstructure evolutions of both the plain solder Sn- 3.5wt% Ag – 0.5 wt% Cu (SAC355) and SAC355–0.5 wt% nano-sized ZnO composite solder.
2) The effect of strain rates ε• from 1.7×10−4 up to 1x10-3 s-1 and testing temperatures T in the range of 298 to 373 K on stress-strain characteristics of SAC355 plain and SAC355 composite wire samples.
3) The effect of aging time on the stress-strain characteristics of SAC355 plain and SAC355 composite wire samples strained at different testing temperatures ranging from 298 to 398 K under constant stain rate of 3.3 x10-4 s-1
4) Tensile creep characteristics of the two solder alloys. The experimental results were investigated under
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different levels of stress ( = 7.2, 8.6, 10.1, 11.5 and 13MPa) and temperature (T= 323, 348, 373 and 398K).
5) Relaxation in both plain and composite solder alloys. The experimental results were investigated under different strain rates ε• from 1.7×10−4 up to 1x10-3 s-1 and testing temperatures ranging from 298 to 373 K.