الفهرس 
CHAPTER 1: INTRODUCTIONOnly 14 pages are availabe for public view
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Abstract
Owing to the harmful influence of lead and lead containing alloys on
the environment and human health, many Pb-free solder-alloys have been
developed to replace Sn-Pb solders in electronic applications. Among
them the Sn-Ag-Cu alloys provide high microstructure stability and better
mechanical properties than Sn–Pb solders. the present work,
characterizations of the microstructure and mechanical behavior were
conducted on three lead-free solder alloys with the compositions (wt. %)
of Sn–3.0Ag–0.5Cu, Sn–3.0Ag–0.5Cu-0.5Ni and Sn–3.0Ag–0.5Cu-
1.0Ni. The study aimed to investigate the following features:
1- Studying microstructure using OM, SEM .
2- Investigating of the thermal properties using DSC analysis.
3- Investigating of the creep properties under different conditions.
4- Investigating of the tensile properties under different conditions.
5- Studying the effect of temperature and applied stresses