الفهرس 
INTRODUCTIONOnly 14 pages are availabe for public view
 |  | from | 158 |  |  |
| | | from | 158 | | |
Abstract
This research deals with the study of the effect of different concentrations of some phenol derivatives on the electropolishing processes of copper in H3PO4. This research includes three chapters: introduction, experimental technique, results, and discussion. The first chapter presents the introduction and theoretical background for electropolishing, mass transfer during electrolysis and effect of additive in copper plating solutions, as well as, the literature survey on the studied subject. The second chapter is devoted to the experimental and measurements of density and viscosity in presence of different concentrations of organic additive mixtures at different temperatures, the cell used and the procedure of measuring the limiting current. The third chapter is devoted to the results obtained and discussion. This involves the effect of the presence of some phenol derivatives on the rate of electropolishing using the cells