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Abstract Electrcdeposition involves metal deposition from an electrolyte into a conductive electrode by application of an electromotive force, The metal ions are driven through the electrolyte by a combination of electrostatics, diffusion and convection, and finally cross the solution-electrode interface (the electric double layer), The metal ion then loses its sheath of solvent molecules (such as water) or complexing anions (such as cyanide) to become a metal ad atom or adion which , in tum, moves on the cathode surface by surface diffusion to a site where it is incorporated into the crystal lattice of the cathcdically formed deposits, Electrochemical deposition involves reduction of metallic ions from aqueous, inorganic and fused salt electrolytes. The reduction process, M’+ (solution) + ne- (metalic lattice) -? M, can be accomplished by processes in which electrons are supplied by an extemal power supply or by electroless (autocatalytic) deposition processes in which a reducing agent in the solution is the electron source (with no extemal power supplied), Many metals are deposited in a very rough or powdery from[l] when elecroplating is carried out at the limiting current density, The possibility of preventing powder formation at the limiting current by means of suitable additive is of great interest and represent a significant activity in electroplating’f , Various organic substances are used as additives in electroplating, electrowinning and electroforming to produce fine-grained, smooth, bright deposits, Organic solvents are also employed in the electrcdeposition of metals, which cannot be electrodeposited directly from aqueous solutions, The kinetics of the electrodeposition of metals involves mainly two steps. |