الفهرس 
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Abstract
In this thesis, three solder alloys were synthesized by adding 0.5 Sb, 1.5In and 1.5Zn wt% on the hypoeutectic ternary alloy Sn-2.5Ag -0.8Cu. DSC measurements showed that the melting temperature of the SAC-0.5Sb, SAC-1.5In and SAC-1.5Zn are 213.21, 208.73 and 214.15 oC respectively.. The microstructure characteristics showed that, the permanent phases formed during solidification are namely, -Sn, Ag3Sn, and Cu6Sn5 within the matrix of the three alloys. The presence of In lead to the formation of Ag2In IMC. On the other hand, finer needle of rich-Zn phase precipitates were observed in the matrix of Zn-containing solder alloy. Creep measurements and stress-strain characteristics showed that SAC-1.5Zn solder alloy has higher stress exponent and higher creep resistance compared with that in both Sb and In containing alloys through all testing temperatures and applied stresses. The calculated activation energies of isothermal creep tests suggest that, the lattice diffusion mechanism and/or dislocation pipe diffusion mechanism is predominant as the temperature DROPs. The values of dynamic Young’s modulus and internal friction, Q-1 of the three solder alloys. SAC-1.5Zn alloy exhibit higher dynamic Young’s modulus and/or lower internal friction than those of SAC-0.5Sb and SAC-1.5In solder alloys.